Competence Center for High-Resolution Superconducting Sensors (HSS)

The Competence Center for High-Resolution Superconducting Sensors (HSS) is a worldwide unique facility for the development and (batch) fabrication of superconducting particle and radiation detectors with extremely high energy and time resolution, currently being established at KIT. The facility is operated in collaboration with the Institute for Data Processing and Electronics (IPE), the Institute of Micro- and Nanoelectronic Systems (IMS) and the partner institution Kirchhoff Institute for Physics at Heidelberg University.

 

The goal of the center is to significantly increase production capacity for superconducting sensors, thereby enabling the development of large-scale experiments based on superconducting quantum sensors. The fabrication focuses on calorimetric low temperature particle detectors and superconducting electronics based on Josephson tunnel junctions, such as dc-SQUIDs or microwave SQUID multiplexers. To realize batch fabrication of these sensors, the equipment is designed for using 6-inch substrates and automated process control.

 

Overview of Production Machinery

In the first stage of HSS, the production machinery consists of the following equipment:

 

  • UHV multi-chamber deposition system for the deposition of various materials
  • ICP-PECVD deposition system for the deposition of insulators
  • Fluorine-based ICP-RIE etching system for metal etching
  • Fluorine-based ICP-RIE etching system for deep silicon etching and insulator etching
  • Chlorine-based ICP-RIE etching system for metal etching
  • Direct-writing laser lithography system
  • Multiple wet benches with spin coater, spin developer, and hot plate
  • Electroplating system for high-purity gold layers

HSS at the Institute of Micro- and Nanoelectronic Systems (IMS)

Floor plan of the technology department at IMS
 

 

The final location for HSS is the Karlsuhe Center for Optics and Photonics (KCOP). The HSS facility within KCOP has been optimally designed based on the fabrication systems and user requirements to ensure efficient and effective utilization of all machines. Since KCOP is expected to be completed in the first half of 2026, the HSS production machinery is currently being set up at its initial temporary installation site, the Institute of Micro- and Nanoelectronic Systems (IMS). A significant amount of the equipment has already been installed and is operational at KIT.

 

In addition to purchasing the individual fabrication systems, all necessary manufacturing processes are currently being developed and optimized. Once the production machinery is relocated and the subsequent installation phase is completed, HSS will be immediately operational, as no major adjustments are expected for the already optimized processes.

UHV Multi-Chamber Deposition System

UHV multi-chamber deposition system
 
Operation Principle

Magnetron sputtering is a physical deposition method in which ions generated in a plasma bombard a sputter target. The ejected atoms are then deposited onto a substrate.

 

Highlights
  • Deposition of various materials by using 12 sputter sources:
    • Superconductors: Nb, Al, Ti, ...
    • Normalconductors: Au, Ag, Cu, ...
    • Alloys: AgEr, AuEr, AuPd, ...
    • Isolators: SiO2, Si3N4, ...
  • Automated process control
  • Simultaneous processing of up to five 6 inch substrates
  • Very high layer thickness homogeneity < 1 % @ 6 inches
  • Determination of the deposition rate using quartz crystal microbalances
  • Oxidation chamber with ion source for pre-cleaning

Upgrade for the UHV multi-chamber deposition system (planned for 2026)

Upgraded UHV multi-chamber deposition system (drawing: BESTEC GmbH)
 
Operation Principle

New integrated coating method - electron beam evaporation: Heating and evaporation of target material by a focused electron beam with subsequent material deposition on a substrate surface

 

Highlights
  • Upgrade 1 - Multi-crucible electron beam evaporator:
    • Six crucibles with a capacity of 6 × 20 cm³
    • Beam power of the electron beam: 3 kW
    • Deposition rate determination by using a quartz crystal microbalance
  • Upgrade 2 - Magnetron sputtering chamber for special materials:
    • Extended temperature range: -70 °C to +750 °C
    • Four face-oriented sputter guns of different sizes

ICP-PECVD Deposition System

ICP-PECVD deposition system
 
Operation Principle

Plasma-enhanced chemical vapor deposition of the insulators SiO2 and Si3N4 using monosilane and TEOS at low process temperatures of approx. 100 °C ensuring device compatibility.

 

Highlights
  • Deposition of high-quality thin films
  • High layer thickness homogeneity < 2 %
  • Fast process control due to high deposition rates
  • Excellent edge coverage
  • Quasi-planar filling of gaps using an optimized combination of cyclic deposition and etching processes

ICP-RIE Etching Systems

ICP-RIE etching systems and ICP-PECVD deposition system
 
Operation Principle

Anisotropic dry etching process for various materials deposited on a substrate by chemical or physical etching using a fluorine- or chlorine-based plasma.

 

Highlights
  • Automatic process control
  • Etching of a variety of materials by providing the appropriate process gases
  • End point detection:
    • Laser interferometry on the substrate surface
    • Spectroscopy of the gas composition

Direct-Writing Laser Lithography System

Direct-writing laser lithography system
 
Operation Principle

Direct exposure of the design onto a photoresist-coated substrate using a 2D high-speed spatial light modulator and a 375 nm solid-state laser.

 

Highlights
  • Photo lithography system for prototyping and batch fabrication:
    • No use of photomasks
    • Fast exposure (9 min. for 4'' wafer @ 100 mJ/mm²)
  • Minimum structure size 800 nm
  • Alignment accuracy 500 nm (backside alignment 1000 nm)
  • Error minimization due to contactless exposure
  • 3D structuring using 128-step grayscale lithography

Customized Wet Bench for Photolithography Processes

Customized wet bench for photolithography processes
 
Operation Principle

Customized wet bench for photolithography processes, i.e. for resist coating of substrates, various baking processes and development after resist exposure.

 

Highlights
  • Automatic coating using pressurized dispense system and edge bead removal
  • Automatic baking process using nitrogen purge with optional proximity baking
  • Automated photoresist development with final DI water rinsing and nitrogen drying